CT-S3062 Two-Component Silicone Thermal Conductive Potting Compound
Core Features
-
Lightweight thermal conduction & heat dissipationLow-density design efficiently dissipates heat, balancing weight reduction and thermal management.
Lightweight thermal conduction & heat dissipation -
Flame-retardant & insulating protectionUL94 V-0 flame retardant and high insulation performance to ensure the safety of high-voltage components
Flame-retardant & insulating protection -
Elastic & impact-resistant protectionFlexible compound absorbs vibration and impact to protect battery cells and circuits.
Elastic & impact-resistant protection
Features
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Low-density lightweight designDensity is approximately 1.35g/cm³, 15%–25% lighter than conventional potting compounds, which effectively reduces the overall weight of equipment and improves cruising range and energy efficiency.
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Elastic and flexible protection systemIt exhibits medium elasticity after curing (Shore A 40±5), featuring vibration resistance and impact resistance to dynamically protect internal precision components.
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Excellent process compatibilityLow viscosity with excellent fluidity; dual curing options at room temperature or under heating for flexible application. Compatible with manual operation and automated production lines for high efficiency.
Technical Parameters
| Item | Standard | ||
|---|---|---|---|
|
Before solidification |
Appearance |
A Component |
Grey black |
|
B Component |
White |
||
|
Viscosity |
A Component |
1500~2500MPa ·s |
|
|
B Component |
1500~2500MPa ·s |
||
|
Density |
A Component |
1.35±0.05g/cm³ |
|
|
B Component |
1.35±0.05g/cm³ |
||
|
A:B Mixing ratio |
1:1 |
||
|
Mixed viscosity |
1500~2500MPa ·s |
||
|
Applicable period 100g/25℃ |
10~60min |
||
|
Solidification time 25℃ |
2~3h |
||
|
Solidification time 80℃ |
15min |
||
|
After solidification |
Appearance |
Grey |
|
|
Density |
1.35±0.05g/cm³ |
||
|
Hardness |
40±5 Shore A |
||
|
Dielectric strength |
≥18kV/mm |
||
|
Dielecriconstant 100MHz |
≤3.0 |
||
|
Volume resistiviy |
≥1.0×10³Q ·cm |
||
|
Thermal conductiviy |
0.6~0.9W/m ·K |
||
|
Flame etardant |
V-0 |
||
Application Areas
-
New energy vehiclesPotting for power battery modules / battery packs, on-board chargers and DC-DC converters -
Lightweight electronicsDrones, light energy storage devices, portable high-end electronic equipment -
Industrial ElectronicsThermal dissipation, insulation and protection for sensors, controllers, capacitors and other components
Product Specifications
1.40kg/set (Component A:20kg/barrel,Component B:20kg/barrel);
2.Customizable according to customer requirements.
Storage and Transportation
1.Store in a cool,dry,and light-protected place below 25℃,and keep sealed.
2.This product is composed of non-flammable and non-explosive materials and may be transported as general chemicals.During
transportation,precautions should be taken to avoid direct sunlight exposure,compression,and impact to prevent leakage.
3.The shelflife of this product is 6 months.



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