Products and Services Adhesive Product SeriesOrganic Silicon High Thermal Conductivity Sealing Adhesive Series

Organic Silicon High Thermal Conductivity Sealing Adhesive Series

The series of high thermal conductivity silicone sealant includes 1W, 2W,3W, and 4W silicone high thermal conductivity sealant.This series of products consists of two components,A andB.Component A is gray black and component B is white. When the two components are mixed evenly in a 1:1 weight ratio or body mass ratio,they will solidify into a gray flexible elastomer

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Product Features

Moderate viscosity & flow, manual/auto dispense

The product features moderate viscosity and favorable fluidity. It is suitable for manual potting, and can also be used with dispensing equipment for automated mass dispensing.
Cure speed adjustable, room/heat curable

The curing rate is flexibly adjustable; it can undergo natural curing at room temperature or accelerated curing under heating to meet different production cycle requirements.
1.0‑4.0W/m・K, electronics thermal cooling

It delivers excellent thermal conductivity with a thermal conductivity range of 1.0～4.0 W/m·K. Featuring high heat transfer efficiency, it quickly dissipates heat from components and satisfies the heat dissipation demands of electronic equipment, capacitors and other devices.
The flame retardant rating reaches UL94-V0

It has excellent flame retardant performance and reaches UL94-V0 flame retardant rating. It self-extinguishes rapidly when exposed to fire, effectively blocking flame spread and improving the safety factor of electronic products.
UV & aging resistant after cure

The cured adhesive is resistant to UV radiation and offers long-term anti-aging performance. It resists yellowing, chalking and cracking under prolonged outdoor exposure, maintaining stable performance over time.
Elastic, moderate‑hard, shock‑proof, waterproof

After curing, the adhesive boasts good elasticity and moderate hardness. It can buffer vibration and impact, while featuring excellent waterproof sealing performance to fully protect internal components.

Technical Parameters

	Item		Unit	Standard
Before curing				S3101	S3202	S3302	S3401
	Appearanc	A Component		Grayish black	Grayish black	Grayish black	Grayish black
	Appearanc	B Component		White	White	White	White
	Viscosity 25℃	A Component	MPa ·s	2500±500	5000±1000	5000±1000	17000±2000
	Viscosity 25℃	B Component	MPa ·s	2500±500	5000±1000	5000±1000	13000±2000
	density	A Component	g/cm³	1.65±0.05	2.80±0.10	3.0±0.10	3.20±0.20
	density	B Component	g/cm³	1.65±0.05	2.80±0.10	3.0±0.10	3.20±0.20
	Mixing ratio		A:B	1:1	1:1	1:1	1:1
	Mied viscosity		MPa ·s	2500±500	5000±1000	5000±1000	15000±2000
	Operating time 25℃		h	>0.5	>0.5	>0.5	>0.5
	Curing time 25°℃		h	4±1	4±1	4±1	4±1
	Curing timee 60℃		h	0.5	0.5	0.5	0.5
After solidification	Appearance			Grey	Grey	Grey	Grey
	Density		g/cm³	1.65±0.05	2.80±0.10	3.0±0.10	3.20±0.20
	Hardness		Shore A	50±5	50±5	50±5	50±5
	Coeficient ofexpansion		μm/m · ℃	<190	<150	<110	<100
	Dielectric strength		kVmm	≥15	≥15	≥14	≥14
	Dielectric constant IHz			≤3.6	≤3.6	≤3.6	≤3.6
	Loss factor IHz			≤0.07	≤0.07	≤0.07	≤0.07
	Volume resistivity		Ω ·cm	≥1.0×10“	≥1.0×10“	≥1.0×10“	≥1.0×10“
	Thermal conductivity		W/m ·K	1.0±0.1	2.0±0.1	3.0±0.2	4.0±0.2
	Flame retardancy			V-0	V-0	V-0	V-0

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Application Areas

Heat Dissipation and Flame Retardancy for Electronics, Electrical Components and Power Circuit Boards

Suitable for electronics, electrical assemblies & PCBs; high thermal‑conductive & flame‑retardant

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Specifications

1.50kg/barrel (component A:25kg/barrel,component B:25kg/barrel)
2.Can be customized according to customer needs

Storage and Transportation

1.Store in a cool,dry,and dark place below 25℃,sealed for preservation;
2.This product is a non flammable and non explosive material that can be transported as a general chemical.During transportation,it should be protected from exposure to sunlight,compression,and collision to prevent leakage;
3.The shelf life of this product is 6 months.

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