Products and Services Adhesive Product SeriesTwo-component Epoxy Potting Adhesive CT-E3006

Two-component Epoxy Potting Adhesive CT-E3006

CTE3006 is a two-component epoxy sealant.TheA component of this product is a viscous liquid mainly composed of epoxy resin and functional powder;while the B component is a transparent modified amine liquid.This product has good fluidity and can be manually filled or automatically filled by a dispensing machine.Afiter curing,it has high adhesive strength to materials such as stainless steel,Al alloy,PBT,ABS,etc.

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Product Features

Moderate viscosity and good leveling property, suitable for manual potting and automatic dispensing machine.

Balanced flowability with excellent self-leveling joint filling effect
It can be cured at room temperature or by heating with low curing exotherm, which will not damage the monolithic capacitors.

Supports dual curing processes. It can complete crosslinking and curing naturally at room temperature, or be heated at medium temperature for accelerated curing, flexibly matching various production cycles.
High bonding strength, offering superior adhesion to stainless steel, aluminum alloy, PBT, ABS and other materials.

General adhesion for metals and engineering plastics; delivers strong adhesion to stainless steel, aluminum alloy, PBT and ABS. The bonded joints feature excellent peel resistance, preventing delamination in multi-material assembly encapsulation.
Excellent waterproof performance. After 1000 hours of double 85 test, the physical properties such as tensile strength and shear strength of the product show minor attenuation.

The dense adhesive layer provides long-term water and moisture resistance. It passes the rigorous 1000-hour double 85 aging test, retains high bonding strength in hot and humid environments with slight attenuation of mechanical properties, ensuring durable and stable sealing and adhesion.
Excellent resistance to high and low temperature shock (-40℃ to 105℃); no cracking or deformation occurs after 1000 hours of temperature cycling shock test.

Excellent adaptability to wide temperature range, free from stress damage under thermal cycling. The adhesive layer remains intact without deformation or cracking after 1000-hour temperature shock cycles, ensuring long-term stable sealing of electronic components.
It features excellent dielectric properties, high volume resistivity and dielectric breakdown strength, as well as good tracking resistance.

It delivers outstanding insulation performance with low electrical conductivity and strong resistance to breakdown under high voltage. No leakage or tracking occurs during long-term service. When used for encapsulating charging guns, aviation plugs and circuit boards, it effectively prevents short circuits for safer operation.

Technical Parameters

Item			Unit	Standard
Before solidification	Appearance	A Component	/	Black/bluelyellow viscous liquid
	Appearance	B Component	/	Thansparent liquid
	Viscosiy25℃	A Component	mPa·s	12000±2000
	Viscosiy25℃	B Component	mPa·s	150±50
	Density	A Component	g/cm3	1.50±0.05
	Density	B Component	g/cm3	1.00±0.05
	Mixing ratio		A:B	100 ：25
	Mixed viscosity 25°℃		mPa·s	2500±500
	Operating time 25°C/125g		min	＞60
	Gel tine 25°C/125g		h	2
	Curing time	25℃	h	12
	Curing time	80℃	h	1
Before solidification	Density		g/cm3	1.40±0.05
	Hardness		Shore D	≥80
	Glass transition temperature		℃	≥110
	Linearceficient of hermal epansion CTE		μm/m·℃	35
	Tensile strength		MPa	＞30
	Elongation at break		%	＞3
	Bending strength		MPa	＞60
	Shear strength A13003/A13003		MPa	≥10
	Dielectric strength		KV/mm	≥25
	Volume resistivity		Ω·cm	≥1.0x1015
	Dielectric constant		/	3.6
	Dielectric loss		%	0.8
	Thermal conductivity		W/m · K	0.45-0.65
	Relative leakage index CTI		V	600

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Application Areas

Waterproof Sealing for Supercapacitors

Suitable for potting and sealing all types of supercapacitors. The dense adhesive layer blocks water and moisture, generates low heat during curing without damaging cells, and features outstanding temperature resistance and anti-aging performance, eliminating liquid leakage and performance degradation caused by moisture erosion.
Waterproof Sealing for Electronic Components Such as Capacitors

Designed for sealing capacitors and various electronic components, the adhesive layer blocks water and moisture, generates low heat without damaging components, and boasts excellent temperature and aging resistance, preventing short-circuit failures caused by moisture erosion.

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Specifications

30 kg per set (Component A: 24 kg per barrel, Component B: 6 kg per barrel)

Storage and Transportation

This product is non-flammable and non-explosive and can be transported as ordinary chemicals. Avoid direct sunlight, extrusion and collision during transportation to prevent leakage.

The shelf life of this product is 6 months.

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