Products and Services Adhesive Product SeriesCT-S2151 Silicone Thermal Conductive Adhesive

CT-S2151 Silicone Thermal Conductive Adhesive

CT-S2151 is a reinforced dealcoholized silicone thermal conductive adhesive that has good adhesion and sealing properties to most plastics, glass,ceramics,metals,etc.after vulcanization molding.It also has good thermal conducivity and can be used for bonding between heating and cooling surfaces

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Product Features

Fast surface‑dry, easy to apply

Short tack-free time enables easy construction operation and effectively improves on-site working efficiency.
1.0W/m·K, electronics cooling

It features excellent thermal conductivity with a thermal conductivity coefficient up to 1.0 W/m·K. It transfers heat rapidly and effectively reduces temperature rise, making it suitable for heat dissipation applications of electronic components, capacitors and other products.
Good electrical insulation performance

It has excellent electrical insulation performance, effectively isolating electric current to prevent electric leakage and short circuits, and ensuring the safe operation of electrical components.
UV & aging resistant post‑cure

After curing and forming, it resists UV erosion and provides long-term anti-aging performance, resisting yellowing and cracking during long-term outdoor service.
High‑low temp thermal‑shock resistant

It boasts outstanding resistance to high and low temperature thermal shock. It is unlikely to crack or delaminate under drastic and repeated temperature changes, making it ideal for working conditions with wide temperature fluctuations.
Strong adhesion, gap‑free cooling

It features excellent adhesive adhesion, resisting detachment under long-term working conditions. The interface fits tightly without voids, stably maintaining efficient heat dissipation performance.

Technical Parameters

	Item	Unit	Standard
Before solidification	Appearance		Grey/White
	Viscosity 25°℃	MPa ·s	Paste
	Density	g/cm³	2.3~3.0
	Surface drying time 25℃	min	5~10
	Tensie strength	MPa	1.5~2.5
	Tensile strength	%	≥100
After solidification	Hardness	Shore A	50~80
	Lap shear strength	MPa	≥1.5
	Dielectric strength	kV/mm	≥18
	Dielectric constant 50Hz		≤3.0
	Volume resistiviy	Ω ·cm	≥1.0×10⁵
	Thermal conductiviy	W/m ·K	≥1.0
	Temperature rangefor use	℃	-60~280

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Application Areas

Filling and Bonding between CPU and Heat Sink

Suitable for gap filling and bonding between CPU chips and heat sinks. It closely bonds the two interfaces, efficiently transfers heat, and provides firm adhesion without detachment.
Gap Filling and Bonding Between Thyristor Intelligent Control Module and Heat Sink

Suitable for gap filling and bonding between thyristor intelligent control modules and heat sinks. It closely adheres to interfaces and delivers both efficient heat conduction and firm bonding performance.
Gap Filling and Bonding Between High-Power Electrical Modules and Heat Sinks

It can fill and bond the gaps between high-power electrical modules and heat sinks, closely fitting contact surfaces to achieve reliable adhesion and efficient heat conduction and dissipation simultaneously.

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Specifications

This product is packaged in plastic ubes with a capacity of300ml/tube and 2.6L/tube

Storage and Transportation

1.Store in a cool,dry,and dark place below 25℃,sealed for preservation;
2.This product is a non flammable and non explosive material that can be transported as a general chemical.During transportation,it should be protected from exposure to sunlight,compression,and collision to prevent leakage;
3.The shelf life of this product is 6 months.

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